TSMC Chairman Mark Liu says the AI chip scarcity will final one other yr and a half, though the supply of the chips themselves shouldn’t be the difficulty.
Firms are struggling to get entry to the variety of chips they should energy AI fashions and purposes, however Liu says the difficulty shouldn’t be with the chips themselves, however with the superior COWOS packaging required to pair AI chips in numerous configurations to maximise their capabilities.
“It’s not the scarcity of AI chips. It’s the scarcity of our COWOS capability,” Liu mentioned on the SEMICON Taiwan trade truthful, in accordance with Nikkei Asia. Liu says COWOS demand tripled within the span of a yr.
“At the moment, we are able to’t fulfill 100% of our clients’ wants, however we attempt to help about 80%. We expect this can be a non permanent phenomenon. After our enlargement of [advanced chip packaging capacity], it needs to be alleviated in a single and a half years.”
Liu says the trade might want to undertake a brand new paradigm for AI chips packaging.
“We are actually placing collectively many chips right into a tightly built-in huge interconnect system. It is a paradigm shift in semiconductor expertise integration,” Liu mentioned.